Ni-doped Effects on Tungsten Copper Electrode III

Except that the density and hardness of tungsten copper electrode, the effect of adding nickel (Ni) on the electrical conductivity of tungsten copper electrode is also can not be neglected. The effect of content of Ni on the electrical conductivity of tungsten copper electrode diagram as follow:

The diagram visually shows that the electrical conductivity of tungsten copper electrode dramatically decreases after adding nickel (Ni). (When the content of Ni is 0%, the electrical conductivity is 34.5%IACS, and the electrical conductivity decreases to 17.5%IACS after the content of Ni reaching 0.2 %.) Afterwards, with the increasing content of Ni, the electrical conductivity decreases constantly. The principle is similar to the adding cobalt (Co) that tungsten dissolved in nickel (Ni), which promoted the sintering densification. A large number of solid tungsten particles bonded contact with each other to form a continuous skeleton, limiting the role of liquid Cu infiltration, resulting in tissue tungsten copper alloy electrode uneven. In addition, external Ni atom enlarges the resistance through electrons of tungsten and copper scattering after adding active element Ni.

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