Tungsten Carbide Micro Drills and Micro Drilling Ⅷ

In part 7 we know that the micro drilling by a tungsten carbide micro drill can also be applied to integrated circuits with finer quality compared to lithography and electroplating technology. Here we talk about the major disadvantage of the micro drills.

Micro drilling has one major disadvantage because of the tungsten carbide micro drill geometry. Because of the drill point, a flat-bottomed hole can not be produced. If one is attempting to produce cylindrical cavities in a micro mold, there must be a relatively thick plating base under the mold material, or the structural substrate of the mold could act as the plating base. To fully develop the diameter of the hole, projected onto a plane perpendicular to the drilling direction, requires the drill point to extend 30% of the drill diameter beyond the depth of the fully developed hole. For holes in the 100 micrometer region, requires a thick plating base to be deposited. One method for creating flat-bottomed blind holes is to use an end milling tool instead of a drill. The disadvantage to this procedure is that drills have a typical L/D ratio of 4 to 14 while end mills typicall have a ratio of only 1.5 to 3.

 (The end. This article is divided into several parts and this is part 8, for part 7 please refer to http://news.chinatungsten.com/en/tungsten-information/80115-ti-10285)

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