Tungsten Copper Electrode Technologies

Except liquid-phase sintering, infiltration and direct sintering, there are some new technologies of tungsten copper come out recently, which make the structure and micro-structure of tungsten copper more stable.

1. Rapid directional solidification

Based on good thermal and electric conductivity, rapid solidification remarkably improves the strength and erosion resistance of tungsten copper electrode at high temperature. However, the cooling rate of rapid solidification is still lower so that solidification structure has sufficient time to grow up and coarsening, which may cause severe support segregation and decrease the properties of tungsten copper.

Given concern such situation, it need to improve the cooling rate by increasing the gradient temperature of the solid-liquid interface in the process of solidification. There are many kinds of rapid directional solidifications, such as SDS (Supercooling Directional Solidification), laser rapid directional solidification with ultra-high temperature gradient and electromagnetic shaping directional solidification.

Tungsten Copper Manufacturer & Supplier: Chinatungsten Online - http://www.tungsten-copper.com/
Tel.: 86 592 5129696; Fax: 86 592 5129797
Email:sales@chinatungsten.com
Tungsten & Molybdenum Information Bank: http://i.chinatungsten.com
Tungsten News & Tungsten Prices, 3G Version: http://3g.chinatungsten.com
Molybdenum News & Molybdenum Price: http://news.molybdenum.com.cn

• < Prev
• Next >