Tungsten Copper Electrode Powder Direct Sintering IV

The general process of powder direct sintering is that: W powder, Cu powder mixed + forming additives → forming →degreasing → sintering → after-processing. Therefore, researchers start their study with ultra-fine powder manufacturing, molding process and sintering process.

2. Forming

At the present, the most popular forming process is compression molding, and the research of MIM (Metal Injection Molding) is boosting gradually. Relative researchers study the process of W-30Cu nano composite material. Using direct sintering, we can get relative density high than 96% of tungsten copper electrode.

3. Sintering

The granularity of nano tungsten copper W-Cu composite powder is small and it is active so that the grain will grow up easily during the sintering process. The traditional liquid=phase sintering will exacerbate grain rearrangement, gathering, combination and growth, which has an effect on the properties of sintering material directly.

It is similar to the method of suppression of WC grain, there are two methods for controlling the growth of grain, one is that adding inhibitors, the other is improving the sintering technology. The enhanced sintering technology includes that HIP (Hot Isostatic Pressing), microwave sintering, extra-high voltage sintering, electromagnetic field sintering, plasma spark sintering, impact sintering and so on.

More information about tungsten copper electrode powder direct sintering, click here:

http://news.chinatungsten.com/en/tungsten-information/79974-ti-10240 
http://news.chinatungsten.com/en/tungsten-information/80018-ti-10242

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