Tungsten Copper Electrode Infiltration VII

The most of study of infiltration focus on qualitative analysis in the parameters, such as temperature, holding time, atmosphere and so on. For tungsten copper, infiltration mechanism refers to copper solution moisturizes porous tungsten skeleton, which flows along the gap of the grain and fills in the pore of the matrix by capillary force. It is important that proper temperature will ensure the small viscosity and large surface tension.

Generally, infiltration often uses H₂ (reducibility) for reducing the oxide of tungsten skeleton, which improves the moisture of the skeleton and the density of tungsten copper electrode. On the contrary, if we use oxidizing gas or carburization atmosphere, the porosity and density or other properties will be remarkably decreased. The study of after-processing includes repressing, hot forging, heat pressing, high temperature insostatic pressing (HIP) and so on. HIP can effectively eliminate the porosity and defects of infiltration.

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